Used HITACHI / RENESAS CM 700X #9160390 for sale

HITACHI / RENESAS CM 700X
ID: 9160390
Wafer Size: 8"-12"
Vintage: 2008
CSP / LOC Die bonders, 8"-12" Bonding up to 3000 UPH Small footprint Applicable for BOC, uBGA,and LOC package Die placement accuracy: +/-36 um (6 Sigma) 2008 vintage.
HITACHI / RENESAS CM 700X is a highly advanced die attach machine designed for high-precision applications. This die attach machine is equipped with a servo motor, which helps it to accurately attach electronic components to boards. This machine is provided with a conveyor belt for guiding the boards during die attaching process. It is designed with a dedicated software, which can be used to adjust the die attach parameters, such as paste thickness, solder paste volume, solder reflow parameters, and die attach accuracy settings. It also assists in creating and storing sequences, such as heating, cooling, and staging, for improved productivity. The machine has an automated pre-heating plate that ensures homogenous pre-heating before the processing of each board. This ensures exact and accurate soldering results, without any defects. The presence of a high-speed microscope enables precise focusing on each component and board in order to lack faults in soldering or die attach processes. HITACHI CM 700X also comes with an advanced x-y table that provides highly accurate alignment and die attach process of the boards. This optimized x-y table is complemented by state-of-the-art translation motors which helps in making precise movements and soldering. RENESAS CM 700X is also equipped with a feature called Laser based Die Alignment Function, which provides accuracy and precision to the die attach process. This laser alignment feature combined with the servo controlled x-y axes work together in order to give precision to the die attach process. CM 700X is designed with optical recognition function which helps in detecting defective boards or components before processing. This visual sweeping system is also able to check the die attach and solder paste volume after processing. This helps in improving the rate of defect-free products. Overall, HITACHI / RENESAS CM 700X is a highly advanced die attach machine, which combines its high-precision technology with high-efficiency machining. This ensures perfect soldering and die attaching results without any flaws or defects.
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