Used HITACHI / RENESAS DB 700 #9145007 for sale

HITACHI / RENESAS DB 700 is a die attacher that applies precise, uniform forces to attach chips to substrate. It features a 360° vision equipment with advanced algorithms to provide accurate and reliable mounting results. The system offers a fully automated process for die bonding, allowing high throughput and low cost manufacturing. HITACHI DB 700 features a fully automated 6-axis ARM robot with an on-board heat oven, a glue dispenser, a vision unit and a patented die attach tool. It can accurately position components for both automatic and manual operations, providing high-speed and precise chip to substrate alignment. The vision machine of the die attacher utilizes advanced algorithms to identify the pick-up and mounting positions on a single chip and to determine the orientation of components. The tool can identify up to 8 chips in one cycle, and can also detect foreign particles, such as dust or dirt. The automotive die level enables high accuracy mounting in a controlled environment, providing low risk for die theft and contamination. The asset also offers a wide range of die sizes and thickness, allowing operators to address a variety of substrate types. The heat oven enables precise chip temperature importance prior to the die attach procedure to ensure optimal results. The patented die attach tool is adapted to fit any substrate size, providing optimal I/O placement with high volumetric accuracy. It also supports chip manipulation up to 17 mm in size and its unique design eliminates potential misalignment between the chip and substrate. All hardware and software components of the die attacher are fully automatic and easy to operate, reducing the risk of human error. RENESAS DB 700 die attacher is a compact and versatile model that provides accurate chip to substrate mounting with fast, highly reliable results. Its sophisticated algorithm based vision equipment, automated process and high speed operation make it an ideal choice for high volume production.