Used HITACHI / RENESAS DB-700 #9360393 for sale

HITACHI / RENESAS DB-700 die attach equipment is an automated precision assembly and scanning system for high-performance, space and cost-efficient production of multi-chip modules (MCMs). This semi-automatic die attach unit makes use of a wide range of test and bonding head designs and programs to attach dies on ceramic and organic substrates quickly and accurately. It is designed to support both standard and advanced chip packaging applications. HITACHI DB-700 is ideal for high-volume die attach manufacturing with its high speed, high accuracy, and high throughput. RENESAS DB-700 machine features a Windows-based user-friendly operation tool with automatic functions for intuitive operation and flexibility. The asset can provide high-precision placement and bond data for optimal bond process. This model offers a wide range of programmable functions to suit various types of die-attach applications. In addition, the equipment has an integrated calibration system and advanced software that allow for precision placement and bond data. DB-700 uses a high-precision coaxial bonding head to achieve maximum bonding accuracy and reliability. The unit has an advanced, high-precision pick and place head which offers a stable contact with the substrate. It supports a wide range of bond heads with different geometries and different sizes. It also maintains an accurate placement of the die and ensures reliable connection with the substrate. In addition, HITACHI / RENESAS DB-700 offers a wide range of test programs and bond heads. Its test programs enable accurate testing and cater to various environmental conditions. The test heads have various settings for all types of bond type and lead-tee designs. HITACHI DB-700 also offers an integrated visual inspection machine that automatically scans and inspects the sample components. Overall, RENESAS DB-700 die attach tool is a high-end, semi-automatic assembly and scanning asset that is suitable for multi-chip module applications. It provides a high-precision placement and bond data for optimal bond process and utilizes a wide range of test and bond heads. Its advanced technologies allow it to accurately place and bond dies to the substrates quickly and reliably. Furthermore, its integrated test programs and inspection model ensures reliable and accurate testing and inspection of the die attach process.