Used HITACHI / RENESAS DB-700AC #293625609 for sale

HITACHI / RENESAS DB-700AC die attacher is an advanced precision die-attaching solution. It is designed to deliver precise and efficient die-attachment for users that require high-yielding, quality results. The tool uses a classical adhesion equipment to ensure that the die is securely attached to the substrate. It has a die-to- substrate pitch accuracy of ± 3.0 microns, which ensures accurate placement of the die and minimizes any unnecessary expenses on rework. The system also utilizes two heated plate operations - one for pre-bonding and one for side-bonding. The prebonding plate is heated to a temperature of up to 140°C to ensure perfect adhesion between the die and the substrate. The side-bonding plate is heated to a temperature of approximately 90°C to enhance adhesion along the side of the die. This ensures that the die is securely and accurately attached to the substrate. HITACHI DB-700AC is also highly flexible and can accommodate a variety of die sizes. With the help of multiple run settings and adjustable head height, users can attach die sizes ranging from 1mm to 30mm. It also features a large-capacity magazine that can be loaded with up to 500 chips. This allows the unit to process large volume orders automatically and at a faster rate than conventional die-attaching systems. RENESAS DB-700AC is also designed to be user friendly and intuitive. It comes with a 14" touchscreen monitor and operates using an intuitive touch user interface. It also has numerous built-in diagnostic functions that enables users to quickly detect and troubleshoot any potential problems. DB-700AC die attacher also comes with a range of after sales support and maintenance services. A team of experienced and trained engineers provides swift and reliable maintenance services that minimize downtime and ensure maximum productivity. The machine also comes with a 24-hour hotline service in case of any technical emergencies. Overall, HITACHI / RENESAS DB-700AC is an advanced precision die-attaching tool that can provide precise and efficient die-attachment with high-yielding, quality results and minimum downtime. It offers a user-friendly interface, flexible die size capacity, and reliable and swift maintenance services. With its advanced features and performance level, this tool promises to deliver quantum performance in production die-attachment results.