Used HITACHI / RENESAS DB-700AC #293635112 for sale

The HITACHYHITACHI / RENESAS DB-700AC Die Attacher is a high-precision die attach equipment designed for use in the semiconductor industry. The integrated compact design of the system allows for efficient and cost-effective die attachment and processing. With a maximum process temperature of up to 450ºC, HITACHI DB-700AC facilitates reliable interconnection between chips and substrates. The HITACHYRENESAS DB-700AC is capable of attaching die up to 0.1mm in diameter and multiple height configurations. The unit is equipped with a high-precision optical alignment machine that can handle up to 166o/s rotation speed. This tool uses a standard 200mm wafer-handling platform that is large enough to accommodate wafers of up to 200mm in a single run. The die attacher employs synchronized vision-guided loading and unloading of chips and substrates that helps ensure repeatable accuracy with each pass. The asset is equipped with a variety of process parameters that are optimized for each application. Variables such as heating rate, cooling rate, pressure and dispensing speed are all adjustable depending on the product requirements. The software is designed with an intuitive user interface that allows for quick and easy production setup and operation. In addition, DB-700AC features an internal air filtering model that provides a clean environment for precision die attach operations. An internal manual cleaning station allows for manual chip-off and cleaning which ensures safe and easy chip-on and chip-off processing. For added versatility, the equipment can be mounted on a manual X-Y table or gantry system to perform manual die attach applications. HITACHI / RENESAS DB-700AC Die Attacher is a dependable and efficient assembly unit ideal for customer critical applications in the semiconductor industry. The high-precision alignment machine, comprehensive process parameters, and cleaning station capabilities ensure reliable assembly of die-on and die-off products.