Used HITACHI / RENESAS DB-700AC #9039928 for sale

HITACHI / RENESAS DB 700AC is a state-of-the-art die attacher that is designed for efficient, fast and precise assembly of semiconductor components. It features an automatic die pick-up equipment with vision guidance and automatic positioning as well as a built-in die chip carrier (DCC), which allows for high resolution image inspection and fast X-Y-Z oscillation placement of semiconductor chips onto the substrate. The system also features a built-in vacuum pick-up and a heated nozzle that maintains a constant temperature to ensure the highest bond integrity. The die attach process is designed with precision and accuracy, ensuring that semiconductor devices are perfectly aligned with the substrate. HITACHI DB 700AC also provides high precision and accuracy for its die attach process, making it possible to accurately place a wide variety of die sizes with a repeatable accuracy of 0.01mm. Its unique die positioning unit keeps die misalignment to a minimum, even at 0.13 mm across the entire DCC field. The machine also allows for a wide variety of die types and sizes, from 0.1mm to 10.0mm in size, to be accurately placed without any vibration or thermal shock. The tool is also equipped with a die reference asset, which includes a reference chip on the DCC to ensure the highest precision and accuracy of the bond. It also features a protection cover to protect the die chip and carrier during the die attach process. The model also has die-attached/stacked/separation monitoring and a dedicated HITACHI controller to automatically program its operation. Furthermore, the equipment is equipped with a 3-axis precision laser device, which ensures extremely high levels of accuracy and repeatability when it comes to bonding and attaching very small substrates. Overall, RENESAS DB 700AC is a very advanced and highly reliable die bonding system that has been designed to provide the highest levels of accuracy, repeatability and consistency for attaching components to a substrate. It is a highly versatile unit that can be used for a variety of applications, from die attaching to DCC-based assembly processes. The versatile design also makes it suitable for a range of development processes, including high-speed production environments. In conclusion, DB 700AC is a reliable, accurate and efficient die attacher that is designed to ensure the highest levels of precision and accuracy when it comes to attaching components to substrates. It is a versatile machine that is highly suitable for a wide range of production processes, as well as for development processes. The tool is also equipped with a variety of features to provide safe, reliable and efficient bonding of components, including die pick-up, vision guidance and programmable operation.