Used HITACHI / RENESAS DB-700AC #9262744 for sale

HITACHI / RENESAS DB-700AC is a state-of-the-art die attacher equipment from HITACHI that allows for automated and precise die attachment to a wide variety of substrates at high throughput levels. Its revolutionary design combines the precision and convenience of a die bonder with the reliability and speed of a wire bonder. HITACHI DB-700AC streamlines the die attach process by providing a multi-functional platform, allowing for automated die pick up, die placement, and die attach. Its optimized system mechanics make for more efficient die attach, with a greater consistency in die location and efficiency in the attachment process. This ensures higher yields with less cycles and fewer defects as well as improved consistency from die to die. Its highly advanced control systems allow for precise control over die attach parameters, such as temperature, pressure, and joint alignment. This ensures accurate die location and attaches with consistent uniformity and reliability. In addition, its advanced algorithms allow for an optimized material utilization unit, to ensure more reliable bonds and reduce cost and waste. The machine's digital vision tool and advanced image processing algorithms enable further improvements in accuracy and consistency. This advanced technology allows for die selection, automatic die pick up, vision alignment and process monitoring, making the die attach process more automated and consistent. RENESAS DB-700AC also utilizes advanced motion control systems to ensure speed and accuracy during the die attach process. This combination of advanced motion control systems, optimized asset mechanics, and automated alignment ensures higher degrees of accuracy and repeatability in die attach, allowing for higher yields and fewer defects. DB-700AC also implements an array of advanced safety and maintenance features. These include an active monitoring model, automated inspection and cleanup routines, and an automated maintenance routine. These features ensure greater safety and reliability in the operation of the die attacher equipment, as well as minimal downtime for maintenance tasks. Overall, HITACHI / RENESAS DB-700AC is a next-generation die attacher system that delivers consistent, reliable die attach performance across a wide variety of substrates. Its combination of advanced control systems, optimized mechanics, and automated alignment make it an ideal solution for achieving fast and accurate die attach processes.