Used HITACHI / RENESAS DB-700AC #9262894 for sale
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ID: 9262894
Wafer Size: 12"
Vintage: 2007
SiP Bonders, 12"
Hard Disk Drive (HDD) missing
2007 vintage.
HITACHI / RENESAS DB-700AC is a high-precision die attacher designed for precise die placement operations. It has been developed to improve process efficiency and yield with the die precision and accuracy of the latest die-attachment technology. HITACHI DB-700AC delivers improved accuracy compared to the prior models, with repeatability of +/- 6.0 Um (micro-meters) over a maximum area of 30.5 mm by 30.0 mm. RENESAS DB-700AC has a large number of improvements over earlier models. It has an improved anti-static device, a newly-designed nozzle structure, and smaller jetting for sure die placement. The advanced camera equipment has improved alignment accuracy and functionality. It features an original die-feeder mechanism with an improved picker for removal of defective die, as well as an optimized nozzle structure for high precision. The unit also provides integration of taping and die-bonding can be realized with the tape transfer device. DB-700AC also features a highly-efficient vacuum system that utilizes a unique combination of a vacuum pump and a vacuum generator to deliver superior vacuum performance. The high precision alignment unit is equipped with two high definition cameras for optimal accuracy, with a viewing range of 13μm. Furthermore, the unit is equipped with a nozzle temperature control machine that allows for multiple nozzle temperature settings for different nozzle sizes. Additionally, the unit has an automated cleaning tool to prevent clogging of the nozzles. This feature also provides a smoother dispense, with improved repeatability and fewer jetting failures. The high accuracy vision asset is designed to maximize yield, and further offers the ability to confirm die placements of the bonded substrates. Thanks to these features, and its efficient design, HITACHI / RENESAS DB-700AC is one of the top die attachers on the market and is perfect for precise die operations.
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