Used HITACHI / RENESAS DB-700SM #9198879 for sale

HITACHI / RENESAS DB-700SM is a fully automated die attacher machine for electronic components that can be used for tasks such as die bonding within the semiconductor industry. HITACHI DB-700SM is a high-accuracy machine with a repeatability of 0.01mm for both die attach and wire bonding operations. It also has a bonded-component displacement accuracy of less than 0.1mm for die attach operations and less than 0.04mm for wire bonding operations. RENESAS DB-700SM features a die-attach preheat equipment with up to 10 zones, and each zone can reach a preheat temperature of up to 450°C. It has a wide selection of available die-attach materials, including epoxy, adhesive and solder, and is also compatible with a range of wire bonding materials. Additionally, the machine has multiple die camera systems, including a fully integrated die vision system, enabling automated die placement accuracy of 0.01mm. DB-700SM has a number of innovative features, including a high-speed 3-axis motion table, a head-mounted high-speed wire bonder, and a PC-controllable Y-axis motion control. It also features a real-time bond wire integrity monitoring unit to check the integrity of wire bonds during operation. Furthermore, HITACHI / RENESAS DB-700SM is equipped with a fully-enclosed and dust-free working environment, which frees the machine from the influence of dust particles, thus protecting the device surface from contamination due to dust ingression. HITACHI DB-700SM allows users to operate the machine from a single control center, allowing for the control of multiple processes such as die attach, wire bonding, and vision inspection. It also has an integrated production database that enables users to monitor the production process in real time, and store data from different production batches accordingly. RENESAS DB-700SM has a 3W+3W+3P+2T discharge device, and allows for the simultaneous bonding of four wire bonds, thus increasing efficiency and productivity in production tasks. Additionally, it features a full-range of optional devices, such as high-temperature pneumatic feeders, automated wire bonding machines, a variety of vision systems, and a board transportation machine, which can provide additional benefits, improving the production process. In conclusion, DB-700SM is a fully automated die attacher machine for electronic components, featuring high-accuracy and repeatability, a wide selection of die-attach materials, an integrated real-time bond wire integrity monitoring tool, and various optional devices that can help streamline the production process.