Used HITACHI / RENESAS DB-700SM #9225641 for sale

HITACHI / RENESAS DB-700SM is a high-performance intelligent die attaching (IDAP) equipment designed to offer efficient and reliable die attach processing. HITACHI DB-700SM is a high-speed semiconductor component die attach system that provides precision control for precise components. This automated unit has a new PIV (Pick-by-Vision) technology which is a vision-based inspection and control machine where images of the die attach are taken through an imaging tool and compared against a 3D die attach template to ensure accuracy and repeatability. RENESAS DB-700SM features a removable trolley which supports management of smaller die attached components up to 8mm, a load port to allow inspection and attachment of LSIs and discrete components and a self-adjusting camera asset which can be used for vision-based inspection. The model has an integrated measuring equipment, which ensures that the die attach process is repeatable with accuracy and is capable of automatically detecting extrusion, air bubble and spatter during attach process. DB-700SM Die Attacher also has a Programmable Logic Control (PLC) system which uses integrated sensors and PLC logic to control the process parameters. It can be programmed to automatically recognize die shapes and to be able to adjust the die attach parameters accordingly. It also has a built-in software program to monitor and control the die attach process. In addition, HITACHI / RENESAS DB-700SM has an integrated vision unit with camera optics and an intelligent vision control machine which can detect and inspect each die before it is attached. The tool can also be used to inspect the underside of components and measure the thickness of the adhesive. HITACHI DB-700SM has a flexible tape transport asset which supports a large variety of tape widths and feed speeds, a high-speed port-to-port transport motion which provides fast and controlled transport of components, and a high-speed loading model. It also has a high-speed machine vision equipment to ensure quality assurance of die attach images and a full machine safety package which includes all safety components and safety wearables. For ease of operation, RENESAS DB-700SM has a large capacity color LCD touch screen with a Windows-style interface that allows operation, monitoring, and management of the entire attach process. This system also has self-diagnosis and self-monitoring features, as well as an energy-saving unit that helps to reduce machine power consumption. Overall, DB-700SM provides high-precision die attach processing with an integrated camera machine that families for inspections and a high-speed machine vision tool to ensure quality assurance of all components.