Used HITACHI / RENESAS DB-700SM #9225642 for sale

HITACHI / RENESAS DB-700SM is a high-precision die attacher for attaching tiny dies to thin substrates using a reliable tool-less bonding technique. Using advanced image recognition technology, the machine is able to accurately identify the outlines of the dies and apply a dab of adhesive to hold them in place. HITACHI DB-700SM is capable of high-speed attachment of devices, making it ideal for high-volume production applications. RENESAS DB-700SM is equipped with a high-resolution CCD camera to precisely pick up the images of the dies as they are suspended in solution in the process chamber. The shoulder camera can capture images in both the visible and infrared spectrums for comprehensive analysis. Through the CCD camera, the die image is analyzed for size, shape, and placement of the die. The software then uses this information to precisely control the attacher's X-Y-Z position and the adhesive dispensing head. The machine operates on a lower pressure, non-thermal bonding process. This is beneficial as it allows for a wider range of substrates to be used. The die and substrate are fed into the system to be located into the bonding area before they are moved into position. The die is then held in place by an adhesive dispensing head before a dab of adhesive is applied. The pressure and release plate can then be moved in to press the die into the substrate before the adhesive begins to cure. DB-700SM uses HITACHI high-precision mechanical design to ensure accurate die attachment and provides reliable performance with a high yield. It supports a wide range of substrates and dies, from 10 to 50 mm in size. The user interface is relatively simple to use, allowing for easy selection of programs for different types of materials, and providing necessary feedback on the die placement process. Additionally, the die attacher provides a real-time display of the die-attaching process, making it easier to monitor the progress of the jobs. Overall, HITACHI / RENESAS DB-700SM is an exceptionally reliable die attacher equipped with sophisticated image recognition technology. Its ability to accurately identify the outlines of the dies and precisely apply adhesive makes it an ideal solution for high-volume production applications.