Used HITACHI / RENESAS DB-700SM #9261477 for sale

HITACHI / RENESAS DB-700SM is an advanced die attacher commonly used in the semiconductor industry. It is a fully automatic machine capable of handling up to 150 die per hour and is equipped to provide precise, repeatable, and reliable attachment of die to substrates. HITACHI DB-700SM offers improved size sensing and precision positioning capabilities that make it the perfect choice for production volume processes. The die attachment process starts with a vision system that recognizes and reads die size information on the wafer and verifies its position. Once the die is recognized, a vision system assesses the substrate ready for attachment. With a 25mm mesh motorized downfeed, the die is accurately picked off the wafer by a vacuum nozzle, located in the head of the machine. Once picked, the vacuum nozzle will precisely position the die on the substrate and gently press it into the adhesive or solder paste. RENESAS DB-700SM also includes several features that make it easier to use and maintain. FC-801C and FCT-801C built-in fuzzy logic offset machines make it easy to adjust die attachment placement and offset. The CCD camera is also user friendly, allowing operators to make any necessary adjustments during operation. DB-700SM also has an intuitive man-machine interface, making it easy to operate and program. The INT heat seal belt conveyor system is also adjustable containing no pinch point risk. This highly reliable device delivers die simultaneously to both heads in few seconds. The highly durable feeder guitar pick offers low die damage and flexibility to change the shape of pick. HITACHI / RENESAS DB-700SM offers superior accuracy and quality for the die attachment process. Its advanced features and user-friendly design make it a great choice for demanding production processes. With its impressive size sensing capabilities and precise positioning, this die attacher can produce reliable and repeatable results with minimum operator intervention.