Used HITACHI / RENESAS DB-700SM #9261478 for sale

HITACHI / RENESAS DB-700SM is a die attacher, used in chip manufacturing processes. This high-precision, bench-top die bonding equipment brings together the superior features of previous generations of die bonders, such as high die placement accuracy, and long lifetime bonding equipment. The machine comes with an advanced and user friendly Windows-based control system for power, temperature, and vacuum. The unit is expandable and upgradeable with optional features, including thermal imaging, laser alignment, a die wash machine, and an extended view. The robust design of HITACHI DB-700SM minimizes vibration and provides a consistent, stable environment for long runs. Its double-loop control ensures high-precision placement accuracy, and its precise workstage tracking with integrated auto focus ensures accurate die positioning. The machine also has CAD-programmable coordinates for accurate placement. The die attacher is equipped with a load-port configuration that makes loading of die trays simple and easy. Its advanced process control library of task-oriented program segments allows for on-the-fly parameters optimization, making it easy to fine-tune the process for specific die sizes. Setpoint control and active thermal imaging make the process easy to monitor and ensures a reliable and high-quality finish. RENESAS DB-700SM is designed for a variety of substrates, including die glass, WLP, and embedded die, and enables multi-die configurations. Its vacuum tool is designed to be easily configurable and allows higher bond heights while providing a high-quality finish. The asset also supports 3D applications, and offers advanced features to allow programming of direction and heights of molds, as well as optionally-configureable die-to-die loss prevention. The user friendly Windows-based software bundle ensures easy setup and operation with consistent and reliable results, and provides a comprehensive set of tools for parameter optimization and enhanced process performance. The software also includes a monitoring panel, statistics and diagnostics screens, and toolless changeovers for speed and efficiency. Overall, whether you're just getting started with chip manufacturing or are a pro needing a reliable, advanced bonding model, DB-700SM is a great option. It's reliable, accurate, and feature-rich, making it the perfect choice for chip manufacturers.