Used HITACHI / RENESAS DB-700SM #9261479 for sale

HITACHI / RENESAS DB-700SM Die Bonder is a high-speed, multi-functional die bonding machine that is designed for use in advanced electronics assembly applications. It offers fast and cost-effective die bonding solutions for the high performance and ultra-high reliability requirements of automotive, industrial, and telecommunications applications. HITACHI DB-700SM is able to handle both wirebond and one-time-programmable (OTP) die bonding of SOIC, TSOP, SOP, and CSP packages. It is capable of mounting die from 2 to 12 mm in size, and has a repeatability rate of ±0.006 mm or less. RENESAS DB-700SM comes equipped with a built-in, high-precision video camera, which allows for easy size determination and registration of the semiconductor die before bonding. The camera utilizes the Kabel-Imaging™ technology, to accurately locate and measure die that are difficult to detect using conventional optical systems. The camera also uses automated position alignment to ensure accurate positioning of the die during bonding. In addition, the machine is equipped with an automated alignment system that can be used to adjust the die placement directly in the programmable stage. DB-700SM is capable of mounting (or etching) die sizes ranging from 2 to 12 mm and heights ranging from 0.3 to 7.5 mm. The machine has a pick-and-place rate of up to 12,000 die/hr, and a bonding rate of up to 36,000 die/hr. It is able to bond both wirebond and OTP die of all package types. The bonding process consists of a series of laser heating and cooling cycles, as well as pressure and displacement adjustments. This ensures a reliable, robust bond between the die and the carrier substrate. HITACHI / RENESAS DB-700SM is user-friendly and intuitive, allowing for easy setup and operation. The machine has a color LCD display for easy viewing of setup parameters. Stored settings can be quickly recalled, and adjustment parameters can be configured without the need for complicated software programming. The machine is also equipped with various hardware interfaces and a host computer connection, which can be used to import and export data. This provides the user with an efficient and convenient way to manage their application processes. HITACHI DB-700SM is a reliable, automated die bonding machine that can quickly and accurately bond die of various sizes, shapes, and package types. Its high-precision camera and automated alignment features ensure precise die placement and accurate die bonding, which are essential for high performance and ultra-high reliability products. Furthermore, its user-friendly interface and easily adjustable parameters make it an ideal solution for electronics assembly applications.