Used HITACHI / RENESAS DB-730SP #9394671 for sale

HITACHI / RENESAS DB-730SP is a die attacher designed to meet the growing needs of cutting-edge semiconductor device fabrication. This compact, high-speed die attacher utilizes the latest technology to precisely cut and place die on substrates with minimal maintenance and setup time. HITACHI DB-730SP is equipped with a camera, die handling equipment, die cutting machine, and die placement system that are all integrated into one approach. The advanced camera unit enables the machine to recognize die sizes up to 60mm or larger. The die handling unit uses a highly reliable 3-axes articulated robot arm that has a flexible orientation and a high-speed handling time of up to 350 wafers per hour. The die cutting unit provides precise die cutting with an accuracy of ± 7m. The 3D structural camera with advanced position-detection capabilities ensures positional accuracy of the die cutting. The die placement unit has an advanced SPM vision machine for accurate placement and positioning of die on substrates. The machine is equipped with a powerful, user-friendly programmable logic controller that allows programming of various parameters including speed, stroke, gripping force, cutting force, robot speed, etc. The integrated setup tool allows for customization of various components for different types of substrates. RENESAS DB-730SP also offers advanced monitoring functions, such as a real-time display of motion history and autorun information, which enables the operator to fine-tune parameters and optimize performance. In summary, DB-730SP is a highly advanced die attacher capable of cutting and placing die on substrates with exceptional accuracy and speed. This machine is the ideal solution for semiconductor device fabrication processes, and is an excellent choice for those looking for an efficient, reliable die attachment asset.