Used JFP MICROTECHNIC DB5-TS #293593197 for sale

JFP MICROTECHNIC DB5-TS
ID: 293593197
Flip chip bonder.
JFP MICROTECHNIC DB5-TS is a die attacher that is designed to permanently attach small components or dies onto a variety of substrates or boards. This die attache is equipped with a force-balance equipment, making it suitable for a wide variety of SMT and attaching processes. Additionally, it can be used for die-attach in processes that require vacuum placement such as Wafer Level Package (WLP) and flip chip interconnects. DB5-TS is a fully automated pick-and-place system, capable of working on various types of SMT and die-attach applications. It has a travel range of 100 x 80mm, providing accuracy and precision when positioning components. It comes with two vacuum chambers, two nozzle holders and two Z-axis control options. The two vacuum chambers provide uniform application of adhesive material to the substrate. JFP MICROTECHNIC DB5-TS is equipped with a proprietary program controller offering a wide range of programming options. It provides a windows-based user interface for programming, visualizing, and operating the machine. This controller is user-friendly and can be used in most environments. Additionally, it is also designed to be easily integrated into existing robotic systems. DB5-TS is designed with a tool-less maintenance unit. This allows users to quickly and easily perform repairs and maintenance with minimal downtime. It also features a self-diagnosis machine, which gives any operator the ability to identify and resolve errors that may arise during operation. The reliability and accuracy of JFP MICROTECHNIC DB5-TS die attacher make it an excellent choice for use in a variety of industries. Its user-friendly design, wide range of programming options, and ease of maintenance are some of its best features, allowing for more efficient and accurate attachment of components. This die attacher is sure to make any process more efficient and cost-effective, with its reliable and accurate operation.
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