Used K&S / ALPHASEM Easyline 8032 #9212349 for sale

K&S / ALPHASEM Easyline 8032 is a die attacher designed for quick and exact die bonding for high-speed semiconductor packaging. This automated die attacher is a cost effective solution for a wide variety of applications, with its fully programmable control system and user friendly PC software. K&S Easyline 8032 is capable of bonding a variety of die sizes, with its adjustable bonding head allowing for different bonding height and force. Its standard tooling is equipped with a 0.250 inch (6.3 mm) pitch, with a maximum bonding force of 80 kPa. The attachment point is centered on the die with an accuracy of ±0.5 mils. ALPHASEM Easyline 8032 also has a dynamic tactile force sensing that detects die tilt and position during placement. Easyline 8032 is driven by an intuitive PC software that allows for easy programming of the various parameters. The Bond Setup Wizard feature makes it easy to quickly program a bond script, with an intuitive graphical interface displaying all parameters. Other helpful features like recipe repeatability let users check and adjust the parameters accurately for each batch. K&S / ALPHASEM Easyline 8032 also supports camera integration for automated die inspection and defect recognition. K&S Easyline 8032 is equipped with dual heating elements for fast and uniform die attachment. The built-in main heating element uses adjustable temperature and time parameters, while the secondary temperature-controlled radius heating element allows for adjustable temperature control. This ensures that all die are evenly heated for optimal bonding. ALPHASEM Easyline 8032 is designed to minimize cross-contamination and requires manual cleaning only when changing die sizes. It also has exhaust air cleaning system for a clean, non-contaminated work area. Easyline 8032 has a low energy consumption and a long lifespan due to its highly efficient design. With its high performance and low cost, K&S / ALPHASEM Easyline 8032 is an excellent choice for high-end die bonding applications.