Used K&S / ALPHASEM Easyline 8032 #9239927 for sale

K&S / ALPHASEM Easyline 8032
ID: 9239927
Vintage: 2004
Die bonders 2004 vintage.
K&S / ALPHASEM Easyline 8032 is a fully automated die attach platform for high volume assembly and semiconductor packaging. It is designed to handle a wide variety of assembly tasks and is able to attach a range of chip sizes. Its flexible, ergonomic design allows for versatile configurations, including inline and manual load/unload heads. K&S Easyline 8032 is powered by an intuitive PLC control equipment for optimal precision. Its high-speed on-the-fly vision system enables placement of up to 99 chiplets per second. The die attach head has a long lifespan and is designed to handle a variety of package sizes and shapes, including CSP, BGA, and flip chip. The unit is capable of accurately positioning the die during the bonding process, delivering high-quality results. ALPHASEM Easyline 8032 is equipped with an advanced cooling machine to ensure proper temperatures for reliable attachment. Its two-stage lead-free soldering technology further ensures high-precision, minimizes waste, and reduces cost. The tool also features a modular 'plug-and-play' dispenser, allowing for quick and easy configuration of fluxes and pastes. Easyline 8032 is designed for precise, repeatable placement of the die at high-speeds. Its ergonomic design makes it easy to operate and maintain, with a small footprint that fits easily into most spaces. Its user-friendly interface makes it simple to set up and troubleshoot, and the asset includes a variety of safety measures, such as an antimicrobial footrail, to keep operators safe. Its full production monitoring ensures consistent high-quality results. Overall, K&S / ALPHASEM Easyline 8032 is an advanced, high-speed die attach platform that is capable of accurately attaching a variety of chip sizes with minimal downtime. It features an ergonomic, user-friendly design and is outfitted with intuitive control and dispensing systems for precise and repeatable performance. An advanced cooling model and two-stage lead-free soldering technology promise quality results and minimal waste, while its production monitoring allows for efficient and consistent production.
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