Used KARL SUSS / MICROTEC FC 150 #293608499 for sale

KARL SUSS / MICROTEC FC 150 is a high-precision die-attaching machine designed for use in flip-chip and wafer level packaging applications. It features a fully automated Vision-based Inspection Equipment, which captures images of each die prior to its placement on the substrate to ensure alignment and positioning accuracy. An integrated micro-fine positioning system with a 30-micron accuracy helps ensure accurate placement of the die on the substrate. MICROTEC FC 150 also includes a patented 3-point micro-manipulator that allows precision placement and control of the die before and during the attach process. The machine has a maximum die pitch of up to 100 microns, making it suitable for a wide range of die placement requirements. KARL SUSS FC150 is equipped with an automated nozzle-cleaning station to ensure continuous and reliable operation, ensuring that the nozzle tips are not blocked, and that nozzles function properly over the lifespan of the machine. MICROTEC FC150 also features a patented Linear Drive Unit (LDS) that can be used to precisely control vertical motion, allowing for ultra-low force attach. This is beneficial for processes such as flip chip bonding, where lower force can help to reduce pad lifting and strengthen die bonds. FC 150 also features a range of process monitoring tools, including a process monitoring tool that checks process steps, as well as a failure recovery module to save process data for later use. Additionally, it has a ID-based Process Changeover machine that ensures that the correct process settings are used on each wafer without the need for operator intervention. In addition to many safety features, the machine also includes a remote-control panel that allows an operator to monitor the machine's operations from a remote location such as a control room or other environment. The remote-control panel is equipped with a variety of status indicators that can detect any errors that may occur during the die attach process. With this information, operators can easily detect and address any errors before they affect the quality of the process. All in all, KARL SUSS FC 150 is a highly advanced die-attaching machine that offers great accuracy and reliability for flip-chip and wafer level packaging applications. Its many features, such as the Vision-based Inspection Tool and the LDS Asset, make it capable of achieving fine accuracy and speed. It also has a full range of monitoring and safety features to ensure top results in every environemnt.