Used KARL SUSS / MICROTEC FC 150 #293637912 for sale

KARL SUSS / MICROTEC FC 150 is a state-of-the-art die attacher for wafer bonding applications. This semi-automatic, programmable equipment is designed to align and attach dies with extreme accuracy and repeatability. It is equipped with advanced control electronics, allowing it to deliver very fine control over the positioning and tension of the bond. MICROTEC FC 150 features a 2W optical microscope with a magnification range of 4x - 20x, allowing it to accurately view and position components in the working zone. The alignment accuracy of KARL SUSS FC150 is 1μm, and the system is designed to ensure repeatable accuracy during repeated die attachment operations. The unit features an XYW linear drive stage, providing automated XY and Z direction alignment. In addition, KARL SUSS FC 150 can perform pick-and-place operations, which allows it to easily pick up, position and attach dies without manual intervention. The machine also features a Hotbar soldering pre-heater, eliminating the need for manual soldering operations. FC150 has an integrated vision tool, allowing it to accurately detect substrates and identify components in the working zone. The asset also has an integrated laser interferometer, allowing it to measure and compensate for any tolerances of the bond surfaces. This helps to ensure the highest bond quality. FC 150 also has an integrated conveyor model, allowing it to automatically feed new substrates and automate the entire die attach process. The equipment can be adapted to handle multiple wafer sizes, and its modular design makes it easy to customize for different applications. All in all, KARL SUSS / MICROTEC FC150 is a highly advanced, precision die attach system designed for wafer bonding applications. Its microscopy, vision unit, and laser interferometer enable it to provide extremely high levels of accuracy and repeatability, while its modular design makes it easy to customize for specific applications.