Used KARL SUSS / MICROTEC FC 150 #293706766 for sale

KARL SUSS / MICROTEC FC 150 is a high-precision die attacher widely used in wafer bonder applications. It has a wide workspace and is capable of accurately bonding dies to a wide variety of surfaces. MICROTEC FC 150 is suitable for both manual and fully automated processes. KARL SUSS FC150 is an all-in-one equipment, incorporating a precision substrate positioning system, a test die, and a die attach-head. The positioning unit provides a high-accuracy, repeatable location of substrates, enabling tight registration and repeatable placement of dies onto systems. It also features automated fine adjustment, allowing the user to adjust the die's position without having to remove it from the substrate. Users can also adjust the sensitivity of the machine, enabling them to attain proper attach pressures of their dies. The test die of FC 150 facilitates an easy and reliable testing of the attach accuracy, alignment, and proper adhesion of the bonded die. The die attach-head is powered by an advanced vacuum-powered pick-and-place tool capable of delivering precision control when bonding and attaching dies. This asset maintains accurate force and speed control of the die attach head, both during the bonding process and during movement, to ensure accurate and repeatable results. All of the features of KARL SUSS / MICROTEC FC150 are designed to make die attach processes easier and more reliable. As such, this model can be used to reduce cycle-time and increase product quality. KARL SUSS FC 150 is equipped with easy-to-use user interfaces and provides a range of options to suit different types of die attach processes. It also comes with manual, semi-automatic, and fully-automatic modes, allowing users to take full advantage of the user-friendly automation to further reduce attach time and improve output quality.