Used KARL SUSS / MICROTEC FC 150 #293799039 for sale

KARL SUSS / MICROTEC FC 150 is a die attacher, designed to precisely and securely attach small semiconductor dies or chips to printed circuit board substrates. MICROTEC FC 150 equipment provides an automated process for attaching dies or chips, including precision die and chip placement, alignment and registration, as well as precise die and chip bonding. The system utilizes a combination of vacuum and mechanical manipulation to securely attach the dies or chips and reduce errors. KARL SUSS FC150 unit consists of three main components: a die alignment and registration station, a vacuum placer head and a vacuum die bonder. The die alignment and registration station includes an X, Y and theta motorized stages and a viewfinder that allow the user to precisely line up the die and substrate to ensure perfect accuracy and alignment. The vacuum placer head performs the actual die placement process, using an array of vacuum nozzles to position the die accurately on the substrate. Finally, the vacuum die bonder utilizes a combination of vacuum force and mechanical manipulation to provide reliable and repeatable die placement accuracy and bond strength. The machine's features include a 0.25mm registration accuracy, 1 micron die placement accuracy, a wide range of die and chip compatibility, and exceptionally fast block cycle times of less than 15 seconds. FC 150 is easy to use and maintain, with a simple user interface and integrated diagnostics capability for troubleshooting. KARL SUSS / MICROTEC FC150 die attacher is an ideal choice for manufacturing and assembly lines that require a reliable, repeatable and accurate die bonding process. By utilizing a combination of vacuum and mechanical force, this tool can offer a secure and reliable bond, while minimizing errors and significantly reducing cycle times.