Used KARL SUSS / MICROTEC FC 150 #9215871 for sale
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ID: 9215871
Vintage: 2003
Flip chip bonder
Part number / Description
50.48.FC150.ST / Flip chip base machine
50.48.83.2000G / Universal bond arm
50.48.83.020020 / -
50.48.66.06000 / Heating chuck, 6"
50.48.OV.01000 / Chip cassette
50.48.OV.03000 / -
50.48.OR.01000 / Vacuum collett
50.48.OQ.32100 / Chip heating tool 2 mm
50.48.OQ.3200P / Chip heating tool
50.48.OS.02000 / Accurate fluid dispense
50.48.OS.0200D / -
50.48.AE.06000 / -
50.48.OP.0300B / Process recording
2003 vintage.
KARL SUSS / MICROTEC FC 150 is a precision die attachment device designed for precision die placement and alignment. It is specifically designed for use in production environments where maximum efficiency and accuracy is needed. The equipment is designed for high accuracy and repeatability, with 150 micron placement accuracy and a repeatability of ±3 microns. It also integrates with a range of die placement systems for automation and flexible solutioning. The system features a high-resolution tactile sensor and an automated vision unit that continually monitors die placement accuracy by using optical sensing technology. This technology offers fast wafer scanning, instantaneous inspection feedback, and higher resolutions than manual systems. The machine is also equipped with an automatic tool condition monitoring tool that provides the operator with detailed information on the exact position of the die attach tool as well as its specific characteristics, such as tool wear or dust accumulation. MICROTEC FC 150 utilizes a programmable Servo control, which permits precise control of die attach tool operating parameters and die placement. This programmable control asset allows operators to adjust the die attach tool's parameters on the fly, even during a die attach operation, thus further increasing the model's accuracy and repeatability. Other features of KARL SUSS FC150 include an automatic tool touch-off equipment, which automatically sets the die attach tool parameters in cases when the wafer and die positions are unknown. Additionally, the system features a closed-loop motion control unit as well as a highly-sensitive temperature monitoring machine. Finally, the tool also provides integration options with a variety of die attach systems and materials including epoxy, solder and paste. KARL SUSS / MICROTEC FC150 is a user-friendly and reliable die attach asset ideal for small to medium-scale production assemblies. By utilizing its high-resolution tactile sensor, automated vision systems, and appropriate process controls, FC150 can provide accurate and repeatable die attachment operations even in challenging production environments.
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