Used KARL SUSS / MICROTEC FC 150 #9232660 for sale

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ID: 9232660
Vintage: 2000
Flip chip bonder System capabilities: 3 Post-bond accuracy: 1 µm Wafer-to-wafer bonding capability: Up to 100 mm² Force: Up to 200 kg Temperature: Up to 450°C Independent heating for chip and substrate NIL Configuration compatible without losing the bonding capability 2000 vintage.
KARL SUSS / MICROTEC FC 150 is a die attacher, designed for high-end precision die attaching in a variety of application fields. Its advanced design allows for accurate and repeatable bonding of dies to substrates with exceptionally high reliabilitity. MICROTEC FC 150 uses a non-contact adhesive process to attach the die to the substrate, ideal for delicate die structures, such as BGA and CSP devices. The die attacher consists of two separate parts, a process head and a base unit. The base unit provides a simple and intuitive 3.2" TFT color LCD touch screen for guiding the operator through the setup of each job. It also houses the air supply, motor drives, safety interlocks and power supplies, conforming to CE, UL and CSA standards. The process head holds the die in a precise position for optimal application accuracy. It features a robust vacuum system to ensure excellent adhesion of the die to the substrate, even at greater die heights. First, pre-set positional data is entered via the LCD touch screen, then the operator manually places the die in the process head and the precision alignment is done automatically. KARL SUSS FC150 also incorporates an advanced automatic optical recognition system, enabling it to detect any errors which may occur in the die position, and adjust the process accordingly. The automatic dispensing needle is adjustable from 0 to 1000µm, ensuring precise, repeatable placement of the adhesive for each die. The needle can be replaced easily, ensuring maximum efficiency and the highest quality results. For even greater convenience and peace of mind, MICROTEC FC150 is equipped with a unique and patented 'under-pressure testing' feature. This tests the substrate before the application process has finished, guaranteeing that any generated adhesive is correctly absorbed and no product leakage occurs. Overall, KARL SUSS / MICROTEC FC150 is an incredibly reliable die attacher, delivering the ultimate in performance and accuracy. Its sophisticated design and advanced features make it ideal for the attachment of delicate die structures, and its intuitive control system means it provides exceptionally simple operation.
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