Used KARL SUSS / MICROTEC FC 250 #88412 for sale

ID: 88412
Vintage: 2000
Flip chip bonder Universal bonding / Transfer arm Universal bonding: Up to 200kg force Die bonding / Soldering applications With production rates up to 120 bonds per hour Chuck size: 2" Waffle / Gel packs: 2" to 4" Solder universal bonding capability High temperature bonding capability: Maximum stage / Tool temperature 450ºC High-precision (± 5 um post bonding accuracy) High-speed multi-axis (6 dof) cartesian coordinate articulation in conjunction With advanced machine vision technology facilitates: Laser stacks Memory stacks Optical switches / Other 3-D assemblies Bonding applications includes: Optical packaging using high speed alignment FPAs LCD Drivers MCMs MEMs MOEMs Most micro-scale components Assembly capabilities includes: MCMs Chip-wafer bonding Missing parts: SMAC Chip Last PM performed Q1 of 2009 Shrink wrapped / Stored in warehouse 2000 vintage.
KARL SUSS / MICROTEC FC 250 is a die attacher, used in the production of semiconductor devices. It is a fully automated equipment that offers a reliable and repeatable process for attaching and affixing dies, wafers, and circuit components to a substrate. MICROTEC FC 250 provides high accuracy and stability, allowing for tight process control and extremely low levels of process variation. KARL SUSS FC 250 utilizes a high-precision servo-driven x-y-z stage to accurately position the substrate and die. It is equipped with an advanced die pick and place system, which is capable of picking up and positioning individual components and die with a high degree of accuracy and repeatability. The unit also features a robust temperature control machine, ensuring precision placement and temperature performance for a variety of die and substrate materials. FC 250 also offers enhanced production capacity with up to four lanes of production and up to 160 dies per batch. Each lane can be independently programmed, allowing for maximum flexibility in production set-up and throughput rates. The design also helps to increase efficiency by providing a smooth transition from substrate feeding to die pick-up, placement and heating operations. KARL SUSS / MICROTEC FC 250 is portable and easy to use, with intuitive touch-screen controls and real-time process feedback. Additionally, it is easy to maintain, thanks to its robust design and quality materials. The tool is compatible with numerous die and component carrier options, including tape-and-reel and trays, allowing for maximum process flexibility and cost efficiency. Overall, MICROTEC FC 250 is a premier die attacher, offering high-precision, robust, and reliable performance for a variety of semiconductor device production processes. Its automated control asset, robust temperature control, and multiple lane production capabilities make it a must-have for any facility looking to efficiently manufacture high-quality semiconductor devices.
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