Used LAURIER / DATACON / BESI CS 1250 #9316079 for sale

LAURIER / DATACON / BESI CS 1250 is a fully-automated electrical die attach machine used for attaching die and die components to printed circuit boards. It is an all-in-one machine, meaning it incorporates all of the die and component mounting processes into one equipment. It is equipped with a precise die-positioning alignment system and automated feeders that allow for consistent high-speed electrical die assembly. BESI CS 1250 is used in the manufacture of different types of electronic components such as chips, transistors, diodes, resistors, and capacitors. The machine is specifically designed to place and bond these components onto printed circuit boards (PCBs). It is possible to attach multiple die components simultaneously to the default PCB through its built-in die attach feeders. LAURIER CS 1250 is equipped with a 32-bit high-speed processor and a 7-inch color touch panel for easy programming and operation. It features a precision die alignment unit that utilizes a vision machine with a 6-zone digital camera to precisely align die components to the designated substrate. CS 1250 is capable of handling a wide variety of components including 0201 chip components, as well as devices with a thickness of up to 8 millimeters. DATACON CS 1250 has a compact design and is able to fit into tight spaces. It has an easy-to-use interface that allows for the setup and management of die boding parameters. It also has a programmable backlight for the feeder, which can be used to set up the machine quickly and reliably. The machine includes an online monitoring tool, which allows for the detection of errors during die attach and to improve the machine's performance. This asset can be used to remotely adjust die positions and other parameters while the machine is in operation. LAURIER / DATACON / BESI CS 1250 has been proven to provide superior electrical performance and precise die alignment while ensuring highly reliable, high-speed attachment of die and components. This die attach machine is perfect for a wide range of applications including CSP, QFN, BGA, uBGA, Flip Chip, Micro BGA, SFP, MEMS, and other die attach and component assembly projects.