Used LAURIER / DATACON / BESI DS 9000E #9127207 for sale

LAURIER / DATACON / BESI DS 9000E is a fully automated die attach equipment designed to bond die to substrates, created using advanced die attach technologies and components. This system is a top-of-the-line die bonder and is well suited for applications covering a wide range of substrates, including silicon wafers, optoelectronic devices, laser diode assemblies, high-brightness LED packages, and power devices. The unit is available in two models: the high-speed model (capable of rates up to 1,500 die/hour) and the basic model (capable of speeds up to 400 die/hour). These models differ in terms of their bonding time, heat pump capacity, and accuracy. Choose the model that best fits your application requirements. BESI DS 9000E is equipped with an automated die load machine which ensures the optimal placement of the die onto the substrate. This automated tool also increases asset throughput by providing quick, accurate die orientations and placement. As part of its automated features, the model can be used for either front-side or backside bonding, achieving extremely precise die placement and alignment. In terms of accuracy, the equipment is capable of a high degree of precision when it comes to location, angle and pressure, making it ideal for applications that require a high level of accuracy. The system also offers built-in safety features such as a die landing pad, a screen alert unit, and an emergency stop safety machine. LAURIER DS 9000E is equipped with advanced optical recognition technology which provides the basis of its machine vision tool, allowing for accurate die orientations and placement. This technology also helps to avoid misalignment, increasing production yields and reducing total costs. The asset also offers an advanced material tracking model, which allows for the efficient tracking of preloaded die and substrates, and a highly reliable handling equipment that minimizes potential damage. In addition, this system can be integrated into existing automated assembly systems, such as pick and place machines. The major advantage of DS 9000E is its ability to bond different types of die, substrates, and materials. From small geometries and heavy components, to thin films and ultrafine lines, all types of bonding applications can be catered for. The unit is also capable of a wide range of materials, from aluminum to copper and steel, increasing its ability to cover a variety of production needs.