Used LAURIER SA 202 #9157352 for sale

LAURIER SA 202
Manufacturer
LAURIER
Model
SA 202
ID: 9157352
Manual die bonder B&L Stereo zoom 4 & 15X EPs.
LAURIER SA 202 is a die-attaching equipment which can be used to securely join dies with substrates, and is used in semiconductor packaging. The system is equipped with digital temperature and speed controls to allow for precise temperature and speed settings. It offers exceptional accuracy and repeatability and reduces packaging time and cost. SA 202 consists of two main components: a base unit and a die-attaching head. The base unit of the unit is made up of a processing chamber, reflow control, and a die-attaching vacuum tool. The processing chamber houses the die-attaching head, which is made of two platens, one is heated and one is cooled. Depending on the type of die being attached, the user can select the type of platen temperature settings required. The reflow control within the base unit includes precise settings for speed, temperature, and cooling rate. The die-attaching head houses both the heating and cooling platens, which move along an automated path while in contact with a substrate. The machine is able to accurately deposit tiny amounts of adhesive material between the die and substrate, providing an extremely tight bond. Furthermore, the tool also has an automatic re-spin feature, which allows for reworking if necessary. The asset is equipped with a motion control unit that is programmed with the coordinates of each die location. This ensures exact placement and orientation of each die, and also provides extra safety and durability. In addition, the model also includes safety features to protect the operator during operation. LAURIER SA 202 is capable of performing a variety of attachment processes, and it can be used to package a variety of products, such as flip chip packages, multicomponent packages, and flip chip dice. The equipment also reduces labor costs and packaging time, making it an efficient and cost effective solution for high volume applications. The system is ideal for any die-attaching process that requires accuracy, repeatability, and secure attachment.
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