Used MICROASSEMBLY TECHNOLOGIES / MAT 6400 #293647179 for sale

MICROASSEMBLY TECHNOLOGIES / MAT 6400 Die Attacher is a state-of-the-art high volume semiconductor die-mounting equipment designed and developed by MAT. It is the first beehive-based die bonding platform in the world and is equipped with precision robotic arms that provide superior accuracy in placing and bonding die on very small substrates and package areas. The system features an integrated vision unit that utilizes scanning technology and advanced algorithms to recognize defects, allowing for a higher level of precision in die placement. Furthermore, MAT 6400 can easily be integrated with existing die placement processes to provide a highly automated solution that is capable of reducing costs and improving quality. The machine offers high-speed, high-volume die placement and bonding. Its beehive structure allows for placing and bonding up to 64 million die per hour, enabling rapid cycle times and increased throughput. The beehive also features an automatic cleaning tool that eliminates the need to manually clean die between cycles. Furthermore, the asset's intelligent vision model recognizes up to 8,000 die per second and can identify any defects in the die or substrate. This allows for a lower number of failed parts due to incorrect placement or bonding. In addition, the die-placement and bonding process is automated using advanced algorithms to ensure the highest level of efficiency and repeatability. The equipment utilizes a ceramic substrate to support the die, and the die are beehive-bonded to the substrate using an adhesive bonding technology. Once the bond is made, the die-assembly is tested for quality, and the data collected is used to adjust parameters that ensure high performance and reliability. The system features robust and easy-to-use software with a user-friendly graphical interface that allows for a wide range of customization, allowing for optimization of the die placement process. It also offers high levels of scalability, enabling it to be easily expanded as production needs grow. Overall, MICROASSEMBLY TECHNOLOGIES 6400 provides a powerful and efficient solution for high-volume die-placement and bonding applications. Its beehive-based design, automated cleaning systems, vision systems, and software make it a strong alternative to traditional die-placement assembly solutions.