Used MICROASSEMBLY TECHNOLOGIES / MAT 6400 #293824384 for sale
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ID: 293824384
Wafer Size: 12"
Vintage: 2012
Die attach system, 12"
Die size range: 0,008" - 1"
Process: Cold and hot temperature, MCM, Flip chip, Eutectic ultrasonic, sliver glass
Die material: Silicon, GaAs, Glass, Metal
Placement accuracy: 3 µm at 3
Throughput: Up to 1000 CPH
2012 vintage.
MICROASSEMBLY TECHNOLOGIES / MAT 6400 Die Attacher is an advanced automated die attachment system by MAT. It is designed to increase the efficiency of through-hole die attach processes and streamline high-throughput semiconductor assembly. MAT 6400 offers high-precision attachment of components from passive devices, such as SMA and higher-level components including power semiconductors and memory chips, with limited or no human intervention. It supports die sizes from 0606 to 2212 and has a direct view camera designed to detect fine features, such as bump pads, studs, and solder balls. MICROASSEMBLY TECHNOLOGIES 6400 employs a combination of advanced algorithms and vision technology to accurately detect the placement and orientation of the die, and quickly verify that the die is securely attached and has no visible defects. Additionally, it can be easily programmed to quickly adjust to components with different sizes and orientations. 6400 is designed to improve accuracy and reduce placement errors compared to traditional manual die attachment processes. Its high throughput and precise placement accuracy help reduce production costs and time. MICROASSEMBLY TECHNOLOGIES / MAT 6400 is equipped with a 3D linear servo drive system, providing high-speed movement with low vibration, precision and repeatability. The servomotors provide variable speed control depending on the product, making it suitable for use in a wide range of semiconductor and other advanced digital manufacturing applications. MAT 6400 comes with a user-friendly interface allowing fast setup of robot parameters and programming of all dispensing, placement and laser soldering activities. It also comes with integrated vision systems and a custom hot air gun, enabling automated quality control and trigger/deform control of components. MICROASSEMBLY TECHNOLOGIES 6400 offers an accurate die-attachment experience for customers and buyers alike. Its high accuracy and low vibration enable sophisticated and reliable die-attach processes. This system helps ensure that your components are securely and perfectly attached, while its versatile programming capabilities allow flexible and cost-effective automation.
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