Used MICROASSEMBLY TECHNOLOGIES / MAT 6400 #9390789 for sale

MICROASSEMBLY TECHNOLOGIES / MAT 6400 Die Attacher by MAT is an automated, inline equipment used to bond microelectronic dies to electronic platforms such as printed circuit boards (PCBs). It has a high throughput rate of up to 36,000 chips per hour and is capable of achieving die placement accuracy of 25 microns or better. The platform is highly reliable and cost-effective, with a lightning-fast placement time of 2 seconds per die. The system consists of three main components: an automated gripping station for picking up and placing dies; a die attach head for patterning and delivering the adhesive; and a cooling/adhesive curing oven. The gripping station on MAT 6400 has 3 grippers, allowing for concurrent setup and replacement of dies of various sizes. It is capable of handling dies with an edge length of up to 5 mm and a thickness of 0.1 to 0.4 mm. The gripping arm has an adjustable X,Y, and Z range and provides a maximum speed of 500 mm/sec for die placement. The station also ensures that any excessive adhesive is removed to ensure accurate placement. It can also be used to inspect dies prior to bonding, providing visual feedback to the operator when anomalies such as scratches or cracked edges are found. The die attach head on MICROASSEMBLY TECHNOLOGIES 6400 consists of a dispensing board with five die attach needles. The needles are set up to deliver small amounts of adhesive for each die. An adhesive reservoir and temperature regulator are used to ensure fast and precise placement and curing. The adhesive nozzle has an adjustable pressure range of 0-150 millibar. Once the adhesive is applied, the head passes over the die and applies pressure with optional vibration to ensure a secure bond. The adhesive curing oven is used to set the adhesive after the die bonding process. It offers reliable and accurate temperature control with a range of up to 350 degrees Celsius. An inert atmosphere can also be created in the oven to protect heat-sensitive materials from damage. The conveyor unit is designed for easy access with a low profile design. 6400 Die Attacher by MICROASSEMBLY TECHNOLOGIES is an ideal solution for high-volume microelectronic die bonding. Its automated, inline machine reduces labor-intensive operations while providing rapid throughput and reliable placement accuracy. Its wide range of features ensures user-friendly operation on a wide range of materials. In addition, its robust design and reliable operation make it a cost-effective tool for die bonding.