Used MRSI 505 #293659168 for sale

MRSI 505 is a high quality attachment die bonding machine designed to efficiently attach die in a wide range of die sizes and packages. This automated equipment is designed to accommodate a variety of die sizes ranging from 0.5 mm^2 up to 150 mm^2 with pitch and ball sizes ranging from 0.5mm to 8.0mm. The system offers a choice of two modes of operation: Semi-Automated (SAS) or Fully-Automated (FAS). Both modes allow for die attachment undervision (UV) or thermocompression (TC) bonding. The SAS mode allows for manual operations and placement of the die on to a substrate as well as the ability to program a variety of repeatable pick and place positions as needed. The FAS mode uses vision-guided robotic motions to place the die on the substrate, providing higher throughput than the SAS mode. The unit also offers accuracy over a 0.04mm repeatability in capability to place die accurately with a force range of up to 3000N for both UV and TC bonding. 505 also offers an open platform that allows for integration of custom vision systems or automated processes. This capability combined with programmable process conditions offer flexibility for specific production requirements. Another benefit of MRSI 505 is its efficient user-friendly interface. The display is a color LCD touchscreen, which allows for an easy setup of the machine and parameters. The integrated software offers real-time monitoring of the process, alarms and the ability to store up to 1000 programs with their associated process parameters. The tool also includes a diagnosis software allowing for detection of errors during operation. In addition, the platform is designed to meet industry safety standards with an integrated UV safety shutter. The asset is modular in design allowing for upgrades or additions to be installed if needed for higher throughput or different attachment applications. Overall 505 is a high-performance, cost-effective die bonding model ideal for a wide range of assembly processes for applications ranging from chip scale packaging to automotive, consumer and industrial electronics.