Used MRSI 505 #9173458 for sale

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Manufacturer
MRSI
Model
505
ID: 9173458
Auto bonder Gantry style (4) Axes assembly work cell (X, Y, Z and theta) Robot arm includes: Compliant gripper with force sensing: Sense down to 10 grams (2) Cameras (2) Optics / Illuminations (two magnifications) Vacuum base plate: For either gel pack / Wafer pack Collet banks: (13) Different pick up tools Die place accuracy: +/- 12.5 micron (2) Eutectic reflow stages Temperature ramp up and active cool down.
MRSI 505 is a die attacher specifically designed for use in the semiconductor industry. It is a fully automated, self-contained equipment that utilizes advanced vision-guided algorithms to accurately attach dies on substrates. 505 is engineered to operate accurately in a harsh, high-temperature environment to deliver high-speed, accurate, and repeatable die-to-substrate attachment. MRSI 505 comes equipped with a CMOS camera and a vision processor, designed to capture and process images of dies and the substrates to which they are to be attached. This technology allows 505 to precisely calculate the die picking position and actively adjust the position during pick-up to ensure that the die is properly attached to the substrate. Additionally, MRSI 505's vision processor allows for more accurate and repeatable die placement by compensating for substrate misalignment. 505 is designed to process a wide variety of substrates of different shapes and materials, including circular display substrates, digital image sensors, memory device substrates, and radio frequency substrates. The system is also equipped with a wafer mounter that can accurately place dies from wafer cassettes and a substrate mounter able to place choose-and-place substrates from magazine tapes. This unit is designed to be supportive of both wafer-level and non-wafer-level packaging needs. MRSI 505's vision-guided precision is further enhanced through the use of Cognex's OCR tool, designed to speed up inspection and identification processes. Using the OCR tool, 505 is programmed to automatically recognize location marks or specific patterns in the substrate and adjust at the die placement position accordingly to provide higher accuracy levels. MRSI 505 is equipped with a Universal Process Interface (UPI) to allow for easy communication between the machine and other components in the production process. This helps operators integrate 505 into existing workflows, making it simple to quickly switch from one product to another without needing to reconfigure the process. In addition to its automation, MRSI 505 is designed to operate safely within a team environment. It is built with a safety casing that ensures fingers and other body parts are kept out of the machine while it is operating, and it is also equipped with a special light curtain safety device. This light curtain safety device is designed to detect movement near the machine and utilizes a braking machine to instantly activate when it senses a person or object near the gripper. Ultimately, 505 is a reliable, accurate, and safe die attacher designed for high-speed, reliable performance while processing a variety of substrates.
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