Used MRSI 705 #293603383 for sale

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Manufacturer
MRSI
Model
705
ID: 293603383
Die bonder Bonding option: COC Eutectic Loading and unloading: Wafflepack / Gelpak Time: 16 sec/pcs Accuracy: X,Y: ±10 µm at 3σ Θ: ±1.0° at 3σ Size: LD Sub: 0.5 mm - 0.8 mm LD (Laser diode): 0.2 mm - 1.0 mm 2012-2014 vintage.
MRSI 705 is a bonder manufactured by MRSI Systems. As a high-precision, automated, and ultra-fast die bonder tool, this device can be used for a variety of applications, such as semiconductor packaging and medical device manufacturing. 705 features a "kill-zone-free" design, ensuring a safe operating environment for the user, as well as top-notch flexibility. It has a 7-axis design which can be configured with several different bonding heads, allowing the operator to precisely specify the parameters of the job. With different pick and place vacuums and a syringe system, this machine can handle any assembly task with ease. In terms of control and accuracy, MRSI 705 is an stand-out product. The powerful and intuitive MRSI Vision software allows the user to accurately determine placement and nest components. By using image processing, it can precisely identify locations and distances, allowing even small and delicate parts to be handled with remarkable precision and reliability. In addition, with its optical microscope, configurations and settings can be updated and modified with astounding speed. When it comes to bonding and assembly, 705 ensures a fast and consistent production process. Features like wire threading and automatic adhesion, plus robotic arm technologies, make sure that all leads, connectors, and soldering processes are performed with maximum speed and quality. Lastly, with its quick product changeover, MRSI 705 is the ideal automated die bonder for use on short production runs. The device allows for quick and easy product set-up and adjustments, facilitating a lightning-fast transition from one product to another and leading to improved overall production efficiency. In conclusion, 705 is a top-of-the-line bonder that provides industry-leading accuracy and performance. With its flexible design, intuitive control software, and automated assembly capability, it is perfect for large-scale semiconductor and medical device manufacturing operations.
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