Used NEC / CANON Bestem-D02 #9159198 for sale

NEC / CANON Bestem-D02 is a die attacher designed for assembling electronic components. It uses NEC proprietary die attacher technology to provide highly accurate placement of dies, ensuring that they are optimally positioned for efficient circuit layout. NEC Bestem-D02 can be set up to perform simultaneous attach and alignment of semiconductor dies on lead frames during the die attach process. It can place up to 2000 dies per hour for high-volume needs. It is highly rated for its high output, extreme precision, and sophisticated alignment sensing capability. The die attacher is equipped with a standard die mounting head for significant temperature stability, making it suitable for a wide range of die sizes. It can be adjusted to a range of temperatures from 110C to 200C in just three seconds, enabling the attachment of small dies and large-size chips. Furthermore, it has a steady-state accuracy rating of 1 mil, allowing highly precise alignment of the die on the lead frame. A unique feature of CANON Bestem-D02 is its high-pressure die mounting head, which helps to reduce the amount of thermal shock on the dies during the attaching process. This also ensures that the dies are properly mounted onto the lead frames, increasing the affixing strength and reliability of the whole setup. The system also includes a secondary measurement head for fine-tuning and continual monitoring of the target location, as well as pressure, temperature, and timing adjustments. The integrated CANON processor offers intelligent sensing to continuously record device conditions and to adjust parameters as necessary, ensuring consistent and accurate alignment. In addition, Bestem-D02 is equipped with a safety system to provide protection against short circuits and overshoot situations. The built-in fail-safe features help to prevent any damages or malfunctions caused by unexpected over temperature conditions or improper die attachment. To conclude, NEC / CANON Bestem-D02 is a sophisticated die attacher that offers reliable placement and alignment of dies. It is specifically designed to address the needs of high-volume electronic component assembly, and its advanced features ensure efficient operation and optimum performance.