Used NEO 8602 #9359443 for sale

NEO 8602 Die Attacher is a compact and lightweight, yet highly reliable die attach machine. This machine is specifically designed for semiconductor production and other microelectronic packaging applications. It is equipped with a fast, accurate, low temperature die bond head. The Die Attacher can secure different types of die from various manufacturers and offers precise control over the alignment of the die, allowing for a precise bond. Additionally, it is equipped with a vision equipment to track and measure the dies accurately. 8602 Die Attacher has a broad range of adjustable settings and features, allowing for maximum efficiency and flexibility while working on a variety of die arrangements. Its variable temperature control allows for low temperature die bonding, with a wide temperature range of 0-255°C. The Die Attacher also offers a wide selection of bond heads, with both standard and target die configuration. The Die Attacher can be used for diebonding components of varying sizes, ranging from 0402 to 66 mm in size, with bond gap and force accuracy of 0.08mm or higher. The Die Attacher also features an automatic die orientation and placement system, which ensures consistent alignment and improved accuracy. It also has a lightning-fast die pick up, with precise placement and force control and the possibility to pause and change settings during the process. The Die Attacher is designed to minimize maintenance and cost of ownership. It is equipped with an easy-to-maintain air unit and a vacuum machine that reduces the need for manual cleaning and servicing. The machine is also equipped with detailed setup and adjustment options, that help to quickly and easily adjust to various tasks. Furthermore, its accurate vision tool ensures that placement and bonding of the die is optimized. NEO 8602 Die Attacher is the ideal machine for efficient and reliable die bonding and can help to maximize the output yield and overall performance. Its compact size and reliable performance make it a great choice for any semiconductor production and microelectronics packaging requirements and can greatly improve production times and output quality.