Used NIDEC TOSOK DBD-2500 #9107844 for sale

NIDEC TOSOK DBD-2500 Die Attacher is a high-precision, cost-effective machine used to die bond semiconductor devices onto a substrate or substrate carrier. It utilizes optical alignment and a bonding process that is driven by tweezers to ensure secure contact between the device and the substrate. The machine features a multi rate capability that allows it to bond multiple device types in a single run and offers an easy setup process that requires little to no operator intervention. DBD-2500 utilizes a high-speed robotic tweezing assembly to accurately pick and place devices. This assembly is mounted on a precision positioning stage and is equipped with a vision system to rapidly measure and adjust positions. The tweezing assembly is also capable of repeatable movements in order to ensure accuracy and optimize cycle time. The machine is also equipped with a high-capacity vacuum unit to help reduce thermally induced stress caused by pick-placing. NIDEC TOSOK DBD-2500 can accommodate different die sizes while still ensuring accurate placement and secure contact. It also features adjustable printing pressure settings to ensure uniform bonding and minimize waste. In addition, it comes with an integrated heater to provide uniform die temperature before bonding and a cooling system to promote rapid curing of the bonding material. DBD-2500 has a high-speed data acquisition system that provides comprehensive feedback on the bond process. This includes real-time data on die placement accuracy, printing pressure, vacuum levels, bond currents, and more. This allows operators to monitor the machine's performance and take corrective actions when needed. NIDEC TOSOK DBD-2500 is an extremely reliable machine that is designed for long-term operation and reliable performance. It is highly efficient, consistently reproducing quality results over time. The robust machine construction ensures that it is able to satisfy the need for reliable, high-quality die bonding processes.