Used NIDEC TOSOK DBD-3310 #9169950 for sale

NIDEC TOSOK DBD-3310
Manufacturer
NIDEC TOSOK
Model
DBD-3310
ID: 9169950
Die bonder Missing parts: Bond head assembly Table X Y motor Motor driving assembly.
NIDEC TOSOK DBD-3310 is a die attacher designed with industrial-level reliability to meet the demanding requirements of the semiconductor industry. This die attacher offers high-speed, linear pick-and-place operations with an accuracy of 0.02mm for precise placement of semiconductor packages onto printed circuit boards (PCBs). With its advanced motion control, DBD-3310 attacher can perform pick-and-place operations up to 600 times per minute. Thanks to its temperature-controlled placement board and die pre-heating table, NIDEC TOSOK DBD-3310 can accurately attach dies even in extreme temperatures. DBD-3310 features a high-speed optical splitter for accurate alignment of dies onto the PCB. This optical splitter consists of two rotating plates designed to securely and accurately align dies at high speeds. NIDEC TOSOK DBD-3310's pick-and-place head is powered by two Y-axis acceleration and deceleration drive motors for precise and rapid placement. An emission head further enhances the accuracy of die placement by precisely controlling the adhesive output. The head's rotary actuation system ensures that die attachment is consistent and accurate while moving its X and Y axes. DBD-3310 also offers an enhanced autofocus feature for increased accuracy and speed. An advanced vision system captures die images while the die is in the position of attachment. This allows the autofocus system to quickly acquire images in real-time and then make precise adjustments during the attachment process. NIDEC TOSOK DBD-3310 also features an advanced CCD sensor for detecting and preventing defects in die attachment. DBD-3310's versatility and user-friendly interface make it an ideal solution for any semiconductor production line. Its auto-tweet feature lets users set up their daily production runs in terms of target numbers and speed. So, adjustments to the die attacher can be quickly handled on the fly, helping to maximize throughput and reduce costs. In summary, NIDEC TOSOK DBD-3310 die attacher is an ideal solution for industrial semiconductor production lines. Its combination of high-speed motion control, advanced vision systems, and temperature-controlled placement board and pre-heating table enable it to accurately attach dies up to 600 times per minute with an accuracy of 0.02mm. DBD-3310 also offers an easy-to-use user interface and auto-tweet feature for seamless on-the-fly production adjustment.
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