Used NIDEC TOSOK DBD-3550 SW Series #100168 for sale
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ID: 100168
Wafer Size: 8"
Vintage: 2003
Die attach machine, 8"
Bonding Method: Solder
Chip Size: 1.0mm - 6.0mm
Bonding Accuracy: XY = ±50 um, Θ±3° (Depends on chip size)
Bonding Weight: 80gf ~ 200gf (Digital setting)
Lead frame: Strip type lead frame. D-PAK, TO-126, TO-202, TO-220, TO-3P
Lead frame Length: 6"-10", Width: 15mm - 70mm
Machine Cycle Time: 0.6 sec./chip (depend on bonding condition)
Index Method: Pin Indexing
Loader: Vacuum stacker / Magazine stacker
Unloader: Magazine stacker (8 Magazines)
Dimensions: 1,900(W) x 1,245(D) x 1,680(H)mm Excludes signal tower
Weight: 1,200 kg (approx.)
Power : AC100 - 200V±10% ,50/60 Hz
Vacuum: -0.07 Mpa Over
N2 Gas: 0.2 Mpa Over
Forming gas: 0.2 Mpa Over
Air: 0.5 Mpa Over
Operation: Windows NT Touch-screen
2003 vintage.
NIDEC TOSOK DBD-3550 SW Series Die Attacher is a highly advanced piece of equipment designed to enhance the precision and speed of die attachment. This versatile Die Attacher is powered by the latest FPGA technology and designed with a cabinet-type structure to maximize working efficiency in the workplace. DBD-3550 SW Series features a low-vibration feeding equipment, which can handle a wide variety of different shapes and sizes of clay parts with ease. Additionally, this Die Attacher has a multi-sensor system with built-in optical sensors, pressure monitor, and a digital laser unit that can accurately detect the desired datum alignment points. NIDEC TOSOK DBD-3550 SW Series also boasts a state-of-the-art in-process die bonding control machine that ensures a uniform die bonding pressure is maintained on every job. It is equipped with a heat source that provides effective heating for the bonding process. In addition, the advanced temperature control tool eliminates overheating during the process and prevents die damages. DBD-3550 SW Series is capable of outputting a high level of power and high-precision process with a minimum of vibration, thanks to its brushless motor. This Die Attacher is equipped with a fast feeder, featuring the ability to feed multiple die-stamping patterns in a single operation. It also has an X-Y displacement mechanism capable of die-bonding to the desired position in the fastest way possible. Not only is NIDEC TOSOK DBD-3550 SW Series efficient and precise, but it also provides a variety of safety features for enhanced security. It is equipped with an emergency stop switch so operators can quickly shut off the power in case of a problem. It also provides an exhaust function to help keep the work area clean, and the air curtain can be removed for easy cleaning. Overall, DBD-3550 SW Series is an extremely high-performance die attacher suitable for a wide range of applications in the die-bonding and assembling industries. With its advanced features and precision accuracy, NIDEC TOSOK DBD-3550 SW Series can meet the needs of any commercial or industrial die-bonding project in the most reliable, efficient way.
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