Used NIDEC TOSOK DBD-3570S #9124535 for sale

NIDEC TOSOK DBD-3570S Die Attacher is a semi-automatic bonding equipment used for the electromagnetic connection of integrated circuit (IC) to its substrate. Its flexible design adapts to a wide variety of tasks such as chip-on-board, chip-on-flexible, and flip-chip assembly. It is equipped with a high-performance pressure pump to meet a wide range of bonding requirements, allowing it to achieve high values of adhesion force stability. The system can be configured with two feeder configurations, the Hang feeder and the Stick feeder, to meet specific process requirements. The Hang feeder allows for significant reduction of floor space requirements, while the Stick feeder provides higher feeding accuracy and speed. Additionally, the angle of the adhesive nozzle is adjustable for improved alignment accuracy. DBD-3570S offers a high-precision die and adhesive dot placement capability, thus providing the highest level of accuracy and process repeatability. Additionally, it features a vision unit that performs accurate die judgment and accurately positions the die and adhesive dots. The machine is equipped with a large-screen monitor and a GUI-based software to support faster setup, changeover, and maintenance operations, thus increasing its usability and reliability. The tool can be equipped with an assortment of accessories such as an inline cross-section observation device, a post-heating oven, a calibration tool, detectors, and an inline die attachment asset. It is a compact unit that can perform up to 9,000 die placements per hour, allowing it to meet the demands of the high-volume production. NIDEC TOSOK DBD-3570S Die Attacher is an ideal model for assembly tasks requiring high accuracy, reliability, and repeatability. Its robust and flexible design makes it an excellent choice for both low-end and high-end assembly requirements. Additionally, its ease of use and small size make it a perfect choice for any application.