Used NIDEC TOSOK DBD3570 SDW Series #100164 for sale

NIDEC TOSOK DBD3570 SDW Series is a die attacher manufactured by NIDEC TOSOK Corporation. The DBD3570 SDW is a state-of-the-art automated die bonding machine built specifically for high-volume, high-reliability die attach applications. It is designed to meet the current and future needs of the semiconductor and electronics industries. NIDEC TOSOK DBD3570 SDW die bonder features a pick-and-place equipment which uses two precision rods to pick up and clean the die before placing it accurately onto the adhesive on the substrate. The platform is robust, easy to maintain and highly adjustable. With a working area of 3.1 x 1.5mm and a Z-axis resolution of 0.01mm, the device can create bonds with high repeatability, accuracy and control. To reduce cycle time, the machine's intuitive user interface (UI) allows for faster operation and data monitoring of jobs on the fly. The DBD3570 also has embedded motion control, a fully programmable logic controller (PLC) for controlling multiple servo motors, and a high-speed machine vision system for identifying and counting die in order to automate the cleaning and placement process. To complete a successful bond, the machine has an embedded micro controller to precisely control the die attach process including the substrate preheat process, the die pick-up and placement, the die bonding process and the post cool-down process. Moreover, the device is equipped with a monitoring unit that ensures a reliable, stable and repeatable thermal environment, even in varying ambient conditions. DBD3570 SDW Series is designed to meet the growing demand for higher levels of performance and accuracy, and is suitable for a variety of industries including automotive, communication, consumer electronics and industrial equipment. To reflow die to substrates, the DBD3570 offers a variety of temperature, time, and pressure parameters for various processes. The device can function as either a stand-alone machine, or easily integrated into larger production lines. It offers high flexibility, scalability and reliability in a production environment. It is readily able to accommodate large batches of die, at a maximum rate of 7,500 pieces per hour, making it a valuable asset to manufacturing processes that require a high-precision yet cost-effective die bonding solution.