Used NIDEC TOSOK GD-300 #293644189 for sale

NIDEC TOSOK GD-300 is an industrial die attacher used for attaching semiconductor dice (chips) to printed circuit boards. GD-300 offers a fast, accurate and reliable means for die-bonding components. The device utilizes a high-speed gripper system and build-in camera vision system. A key feature of NIDEC TOSOK GD-300 is its adjustable nozzle that can be configured to meet the specific requirements of different size die packages. The nozzle is also made of non-magnetic materials, providing enhanced accuracy and repeatability. GD-300 is equipped with a robot arm, which can be programmed to perform multiple operations in quick succession. The robot arm is equipped with an XY tilt stage, and allows the nozzle to be placed precisely in the optimal position to maximize the bonding force. This allows NIDEC TOSOK GD-300 to attach and secure the most advanced and sophisticated die-bonded components. GD-300 also features automatic die-bond compensation, ensuring the right amount of force is applied when placing the die on the board. This feature also helps minimize the need for manual labor, as no manual adjustment is required before installation. In addition to its features, NIDEC TOSOK GD-300 is easy to use and maintain. Its intuitive LED display provides easy access to its various selection, setting and control menus. Additionally, GD-300 offers several safety features, including an overcurrent protection mechanism and an emergency stop switch. Overall, NIDEC TOSOK GD-300 is an advanced die attacher suitable for any production environment. It offers fast, accurate die attachment and reliable operation with minimal manual adjustment. Its easy-to-use LED display and safety features make GD-300 an ideal device for all of your die-bonding needs.