Used NIDEC TOSOK ICB5210R-C #9393509 for sale

NIDEC TOSOK ICB5210R-C die attacher is a state-of-the-art past device for automating the process of attaching dies to a printed circuit board (PCB). It features a unique modular design with an integrated dual-column die bond head and a servo-driven X-Y motion stage, making it ideal for applications requiring precision placement and alignment of dies. The device's die bond head is equipped with an advanced vision equipment and multi-function button panel that allows for automatic and manual operations. Its integrated vision system is capable of recognizing, locating, and applying various types of dies to a PCB. ICB5210R-C is powered by an energy-efficient electronic control unit that provides real-time control over die placement. The device is also equipped with high-speed and accuracy motion control, which enables a wide range of placement and manipulation operations. It features flexible pick-and-place head design, as well as a high-resolution auto-detection machine, allowing for improved precision and accuracy while working with a variety of die sizes. NIDEC TOSOK ICB5210R-C is capable of providing a consistent die placement and alignment process, leading to higher yields. Aside from its die-attaching capabilities, ICB5210R-C also offers a robust workflow-management tool. The device is equipped with nine-pocketing tools for loading strips of material, along with up to eight die-bond workstations, which can be loaded with dies and moved into place, allowing for maximum production throughput. Moreover, its programmable auto-exchange function enables easy exchange of dies, providing a quick turn-around time. NIDEC TOSOK ICB5210R-C die attacher is an ideal device for any PCB manufacturing facility looking to streamline the production of PCBs. It offers superior precision, accuracy, and control, enabling consistent die placement and alignment with minimal effort. Furthermore, its workflow-management asset ensures maximum throughput and uptime, while its programming capabilities provide for easy transfer and exchange of dies. With its energy-efficient design and flexible features, ICB5210R-C is the perfect choice for intricate die-bonding operations.