Used NIDEC TOSOK IL-B5000 #9393459 for sale

NIDEC TOSOK IL-B5000 is a high-performance die attacher specifically designed for the semiconductor packaging industry. It is capable of attaching any type of die or component to the package surface using various materials such as gold, aluminum, copper, and more. Using the latest in technological advancements, IL-B5000 is able to align and press the die into place with high accuracy and repeatability, ensuring proper contact with the package surface. NIDEC TOSOK IL-B5000 features multiple options for die attachment including manual, semi-automatic, and full automatic processes. It is equipped with both a vision system and a bump inspection system for proper alignment and die placement. The die attaching machine also utilizes a control feeder with constant speed and precision to deposit the material for attaching the die. IL-B5000 is also designed to cover a wide range of material thicknesses for the attachment process. With a connection speed of up to 1000 attachments per minute, it is designed to be highly efficient, saving time and money. This die attaching machine can easily be reconfigured depending on the specific application, ensuring maximum flexibility for the user. Overall, NIDEC TOSOK IL-B5000 is an efficient, high-performance solution for die attachment in the semiconductor packaging industry. The wide range of features it offers provide users with consistent, high quality die attaching results for any application. With its customized options for die attachment and ultimate flexibility, IL-B5000 is certainly a powerful attaching machine that is sure to meet the requirements of today's packaging industry.