Used NIDEC TOSOK ILB-5000 #9384639 for sale
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NIDEC TOSOK ILB-5000 is an advanced die attacher that is designed to improve the accuracy, speed, and reliability of chip bonding processes. Its unique design is optimized to make the chip bonding process simpler, faster, and more efficient. ILB-5000 is built with a heavy-duty, pneumatically-driven servo-motor that provides smooth, uniform, and consistent pressure throughout the entire chip-bonding process. Its integrated dynamic-focusing lens has the ability to capture every minor detail of the chip's surface and aid in accurately maintaining a high-profile bond throughout the entire operation. An automated lens control feature allows for maximum precision by quickly adjusting the focal point of the lens to compensate for chip movement. In addition, NIDEC TOSOK ILB-5000 is equipped with a programmable, high-resolution scanning system capable of accurately scanning chip surfaces up to 0.0001 inches. This allows the machine to accurately recognize various chip profiles and sizes in order to accurately bond them together. Furthermore, the scanning system can also quickly detect bond irregularities and terminate the process, preventing unnecessary bonding. ILB-5000 is also designed with a high-speed positioning system that can accurately place the chip into the desired position and then quickly lock it into place. This helps to ensure that the chip is properly fixed in place and will remain securely locked while the machine is running. Finally, NIDEC TOSOK ILB-5000 has a user-friendly operator touchscreen to configure, display, and control the operation and the speed of the machine. By using this touchscreen, operators can easily adjust the various settings and configurations to optimize the die-bonding process and minimize the overall production time. Overall, ILB-5000 is an advanced and reliable die attacher designed to improve the speed, accuracy, and reliability of chip-bonding processes. Its integrated components provide maximum precision and minimize production time, while its user-friendly interface enables operators to quickly and efficiently configure and control the machine. With its performance and features, NIDEC TOSOK ILB-5000 is an ideal choice for any die bonding operation.
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