Used NIDEC TOSOK ILB-5210S #9393440 for sale

NIDEC TOSOK ILB-5210S is a die attacher developed by NIDEC TOSOK Corporation and used in semiconductor production. This artically controlled die attacher is used to attach semiconductor chips to the PCB board through a series of welding. It offers advanced functionality and high performance for mass production of complex devices. ILB-5210S is a high-precision model designed for utilization in semiconductor production. It comes with an optimized die bonding equipment that integrates the latest features and technologies available. The die bonder comes equipped with a high-processing speed, improved precision, and an excellent cycle time. The die bonder utilizes an innovative CCD camera-assisted positioning system for superior accuracy. The CCD camera is able to detect fine details for precise alignment while the series of welding plates are designed for optimal dimensional accuracy. This ensures that each chip is accurately positioned in the correct place. NIDEC TOSOK ILB-5210S comes with a unique clamping unit that provides a secure bond between the chip and PCB. This clamps the chip firmly to prevent any shifting and misalignment during the bonding process. It also ensures seamless power connection between the chip and PCB. The die bonder has a simple and easy-to-use interface. An intuitive user interface allows easy operation and control of the die bonder. This user-friendly interface features a highly visible status display and a series of warning indicators to alert the operator of potential malfunctions and errors. ILB-5210S also offers advanced maintenance features and a comprehensive technical support machine. It is equipped with a self-diagnostic tool to detect potential problems and discern any issues with the performance of the machine. This self-diagnostic asset is designed to offer an in-depth analysis of the machine and provide comprehensive information on its performance. NIDEC TOSOK ILB-5210S is a reliable and powerful die bonder that provides a fully integrated die bonding solution for mass production of complex devices. With its high-precision model, user-friendly interface, and advanced maintenance features, ILB-5210S enables simple and efficient production of precise semiconductor devices.