Used PANASONIC DM60M-H #9284289 for sale

PANASONIC DM60M-H Die Attacher is an advanced, automated die attacher solution designed to deliver high speed, high accuracy die attachment for semiconductor device packaging. With its powerful and its user-friendly features, PANASONIC DM60MH provides fast and accurate die mounting on a wide variety of devices for a range of advanced semiconductor applications. DM 60MH is equipped with four-jaw face-down chuck with a maximum clamps opening of 15mm. This allows the die to be securely held in position during the attachment process. This ensures that the die is positioned accurately and securely during the attach process. The chuck is also adjustable to accommodate die of various shapes and sizes. DM 60 M-H is also equipped with a precision servo motor drive with a maximum loader speed of up to 8,000 RPM. This state-of-the-art system provides a higher speed and accuracy than many other automated die attacher solutions, allowing the user to process the die faster on a variety of substrates. In addition, PANASONIC DM 60 MH is also equipped with an advanced vision system that provides non-contact scanning of the die surface as well as accurate image analysis. This system is able to identify common process defects as well as perform edge offset and distortion detection. It also rapidly adjusts the position and orientation of the die for placement on the target surface. DM 60M-H is also capable of data logging and monitoring of the entire die attach process, allowing the user to record and review process conditions. The automatic recording of process parameters enhances device yield and reliabilities. DM 60 MH is also designed with safety features to protect the user from severe vibration or physical contact. It also offers a 20-degree tilt for quick and simple die handling. PANASONIC DM 60MH is a robust and reliable advanced die attacher solution designed to meet the needs of advanced semiconductor device packaging. With its high-speed and accuracy, PANASONIC DM 60M-H is ideal for a wide variety of semiconductor applications, and is an invaluable tool for packaging teams in the semiconductor industry.