Used PANASONIC FPX501 #293608127 for sale

Manufacturer
PANASONIC
Model
FPX501
ID: 293608127
Flip chip bonder.
PANASONIC FPX501 die attaching machine is the next generation of advanced die bonding machines. FPX501 is designed to address the precise and precise demands of the semiconductor industry while maintaining an impressive level of precision and accuracy. The machine uses a special vision equipment to accurately place and secure dies, as well as an innovative die system that ensures precise and repeatable die placement in the most precise and reliable manner. PANASONIC FPX501 delivering the highest level of quality, accuracy and performance - can sequences up to 3500 dies/hour on a 75mm2 panel, with a typicaail pitch of 50µm. The die table features a powerful vacuum, vacuum nozzle, and die and tip chucks to ensure that all dies are securely attached to the substrate. Furthermore, the machine features low resolution X, Y, and N-thresholds cameras and a patent pending, automated die-to-die algorithm that guarantees precise placement of each die. A monitoring unit is used to detect and correct any mis-alignment or the lack of vacuum. Due to its advanced vision systems and die placement technologies, FPX501 can provide highly accurate contact between the substrate and die using an extremely low-profile and miniaturized process. This ensures improved die attach yield and can be done on site and in a cleanroom-friendly fashion. The machine has a 12-axis robotic arm that has a small inert electrostatic discharge (ESD) of less than 30 volts. This ensures that the device is safe for cleanroom operations and does not require outer suctioning or other precautions. PANASONIC FPX501 die attaching machine comes with an optional vision machine add-on. This add-on requires no external vision tool interface to achieve full coverage and is designed to identify and orientate components on the substrate in order to achieve exact alignment and placement. This advanced vision asset technology also allows for accurate detection and correction of any die shifting. Additionally, this model is backed by a dedicated team of experts in die-placement and semiconductor technology so that customers can receive the support needed to get the most out of their machine.
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