Used QMC DSR-400 #9276079 for sale
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ID: 9276079
Die sorter
Automatic wafer loading / unloading
Vertical LED chip probing type
Integrating sphere application
Spectrometer: CAS140 Application
Source meter: KEITHLEY 2611 Moder application
Thyristor measuring.
QMC DSR-400 is a precision die attacher designed for die attachment applications in a range of industries. It enables highly precise attachment of dies to substrates with minimal human intervention. DSR-400 uses a patented nozzle design to deliver adhesive via an integrated hot glue gun nozzle, which minimizes die displacement while providing excellent coverage. The attacher can also be fitted with an optional vision system to guide the nozzle path and ensure accurate placement of the dies. The vision system can also be used to inspect the substrate before, during, and after the die attachment process. QMC DSR-400 employs a servo-motor driven robot arm to ensure precise movement and positioning of the hot glue gun nozzle and die. The robot arm is equipped with quick-release clamps to allow for fast loading and unloading of dies. The robot arm is powered by a brushless servo-motor and controller, providing high speed and accuracy while minimizing maintenance requirements. The robot arm is paired with an intuitive touchscreen interface, allowing the operator to monitor and control the operation of DSR-400. Advanced control algorithms, such as PID looping, provide consistent performance and help ensure that QMC DSR-400 meets the user's desired performance specifications. DSR-400 features a modular design, allowing for easy upgrade and integration with other technologies. The system can be expanded with a range of feeders and end-of-arm tooling to increase automation and improve throughput. It is suitable for a variety of substrates, from semiconductor die to microelectronic die, and can be connected to a range of external systems for automated data collection. QMC DSR-400 is a robust and reliable die attacher, designed to meet the most demanding of applications. It is capable of providing high accuracy and throughput for die attachment projects,while allowing for rapid change-outs for maximum flexibility and product quality.
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