Used RENESAS (Die Attachers) for sale

RENESAS is a leading electronics manufacturer that offers a variety of die attachers for semiconductor packaging. One of their notable product lines is the CM series, consisting of CM 700, CM-700 DAF, CM 700H, and more. These die attachers are designed to provide efficient and reliable bonding of semiconductor chips to substrates. The RENESAS die attachers use analogues to ensure high precision and quality in the bonding process. They employ advanced technologies like ultrasonic bond, eutectic bond, and thermocompression bond to achieve strong and precise connections. This allows for optimum performance and reliability of the semiconductor device. The advantages of RENESAS die attachers include high productivity, excellent bond quality, and flexibility to handle various chip sizes and materials. They offer fast cycle times, enabling rapid production to meet market demands. The bond quality ensures robust connections that withstand thermal and mechanical stresses, ensuring long-term device performance. Additionally, these die attachers are adaptable and customizable according to specific customer requirements. Examples of RENESAS die attachers include the CM 700, a versatile solution for high-speed bonding, and the CM-700 DAF, which combines ultrasonic bonding and eutectic bonding for improved reliability. The CM 700H caters to the higher-volume manufacturing needs with increased productivity. These examples highlight the diverse offerings from RENESAS, providing effective die attachment solutions for various semiconductor packaging applications.